France

In this presentation, background and motivation will be explained for mmW/THz wireless communication as well as basics of phased-array theory. The theoretical limitation and possible direction of mmW/THz wireless communication is discussed with a THz phased-array transceiver implemented by 65nm CMOS.


ESSCIRC ESSDERC Educational Events

Millimeter-wave/THz Phased-Array Transceiver for Beyond 5G

phased array

millimeter-wave

cmos

#### Welcome to the 62nd IEEE International Reliability Physics Symposium (IRPS)! 
**The 2024 IEEE International Reliability Physics Symposium (IRPS) was held in Dallas, Texas from April 14 to 18, 2024.** 

[![](https://assets.underline.io/uploads/markdown_image/1/image/9cc005f94b4ba4a81918eb49e0a51057.png)](https://underline.io/events/446/reception)
[![](https://assets.underline.io/uploads/markdown_image/1/image/acae953ba70ae2a57eed7b0250d6dd7d.png)](https://www.irps.org/)
[![](https://assets.underline.io/uploads/markdown_image/1/image/e1806748f2fc69f825e596872a7afdfd.png)](https://drive.google.com/drive/folders/1SmhpLZD9swYxrfP0TYF6327QTIciy3tV?usp=drive_link)
 

**[IRPS 2024 eGuide](https://drive.google.com/file/d/1DHxkWbafodK_D2HlDi7lwRK7KatgBgBD/view?usp=drive_link)** 
Please save the zip file locally and click the "start.pdf" to view the file. 
 
**IRPS 2024 General Chair Welcome Message**

On behalf of the Management Committee of the IEEE International Reliability Physics Symposium (IRPS) and the IRPS Board of Directors, it gives me great pleasure to extend a warm welcome to all who are planning to attend the IRPS 2024, scheduled to take place from April 14-18, 2024, in Dallas, TX. 
Over its 62-year history, IRPS has solidified its position as the premiere conference for engineers and scientists to present new and original work in the field of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and other parts of the world, IRPS aims to deepen our understanding of reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS offers diverse opportunities for attendees to enhance their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

The IRPS 2024 technical activities will begin with two days of a total of twenty tutorial sessions covering a broad spectrum of emerging reliability topics beyond CMOS device, circuit and system reliability. These sessions are devoted to both newcomers as well as experts. Three reliability Year in Review (YIR) talks focusing on neuromorphic computing, dielectric breakdown in leading edge devices, and GaN technology will be provided on Monday after the tutorials.

The IRPS 2024 technical program will feature four distinguished keynote talks in the plenary sessions delivered by Prof. Shinichi Takagi from The University of Tokyo and Dr. Su Jin Ahn from Samsung on Tuesday, Dr. Rajeev Malik from IBM on Wednesday, and Dr. Sameer Pendharkar from Texas Instruments on Thursday. The technical program, organized into three parallel tracks, consists of contributed and seventeen invited papers from leaders in industry and academia. Additionally, two invited talks by recipients of paper awards from our sister conferences, European Symposium on Reliability of Electron Device Failure Physics and Analysis (ESREF) 2023 and the International Integrated Reliability Workshop (IIRW) 2023, will be given in the technical program. 

Tuesday evening will host ten workshops, offering an opportunity for in-depth, face-to-face discussions on emerging reliability challenges, including the three IRPS 2024 focus topics. A poster session will be held in the Austin Ranch outside the symposium building on Wednesday evening. Both events are sure to be lively. The IRPS 2024 and the International ESD Workshop (IEW) will be co-hosted with IEW registrants participating in both IRPS and IEW programs.

The IRPS 2024 will adopt a hybrid conference style, allowing virtual access to live oral presentations hosted by the Underline. Real-time streaming of all technical events (excluding Workshops and Posters) will be available in the US Central Timezone, providing virtual attendees with Q&A opportunities. For those virtual attendees who cannot watch the live presentations, the material will be available on demand to all attendees after the symposium. All authors will be presenting in person.

Finally, I would like to extend my extreme gratitude to our patrons, exhibitors, and all participants for their invaluable support, which makes IRPS successful. 

Please enjoy the IRPS 2024!

Koji Eriguchi, General Chair 
of 2024 IRPS Management Committee
 
**About IRPS** 
The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.

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IRPS 2024 Main Conference

The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. 

technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

Please register for educational events at the following link: https://www.registerme.eu/event/esscirc-essderc-2021/

Please register for the ESSCIRC/ESSDERC Educational Events to join the event.

The Educational Events of ESSCIRC ESSDERC 2021. 

The novel photo-acoustic CO2 sensor SCD4x launched by Sensirion in early 2021 represents a major innovation step in the miniaturization and cost-reduction of selective and long-term stable CO2 sensor technology. Being the first optical CO2 sensor compatible with surface-mounting technology and made for reflow soldering, the sensor allows for a broader adoption of indoor air quality monitoring both in residential air conditioning as well as internet of things devices. In my talk I will address how MEMS and CMOS technology combined with tailored assembly and packaging designs has enabled shrinking a measurement system previously reserved for scientific laboratories to an SMD component of the size smaller than a sugar cube.

Breaking the size barrier in CO2 sensing: the photo-acoustic CO2 sensor “SCD4x”

In recent years, an enormous surge of works is being carried out on developing new methods for magnetic devices for various kinds of healthcare applications. Miniaturising magnetic sensors offer the prospect to replace the bulky laboratory instruments with easy-to-use clinical platforms ranging from portable lab-on-a-chip diagnostics to wearable and implantable devices. It would bring down the cost, size and out-of-hospital use by several orders of magnitude. Implementation of such magnetic sensing microsystems using traditional CMOS technology is inefficient in terms of area, sensitivity and signal to noise ratio. Such inefficiencies have driven a significant effort to investigate the development of beyond-CMOS devices. Integration of magnetoresistive devices, e.g. Tunnelling Magnetoresistive (TMR), with CMOS technology provides an opportunity to produce and optimise powerful and low-power devices for low biomagnetic field applications. Such heterogeneously structure combining the CMOS circuitry interface and non-CMOS sensors higher performance electronics for detecting pico-Tesla magnetic field. 
The talk will introduce our research at the Microelectronics Lab (www.melabresearch.com) at the University of Glasgow on integrated electronic circuits and sensors with several different works addressing the development of architectures for the implementation of efficient biomedical wearable and implantable technologies. It presents findings and trends in magnetic sensing devices, including:
(i) Tunnelling magnetoresistive (TMR) sensors and circuit Interfaces for malaria parasite detection
(ii) Integrated micro–Nuclear Magnetic Resonance (micro-NMR) for point of care diagnostics
(iii) Implantable Magnetomyography (MMG) with magnetoelectric (ME) and TMR sensors 
(iv) Spintronic sensors based on Magnetic Tunnel Junction for wearable eye movements monitoring


Principles of Magnetic Sensing in Medical Microsystems

In less than a decade, optical sensing has become a key topic because of the growing potential in spectroscopy, chemical and biomolecular sensing, security and industry applications. This talk presents recent results on the chip level integration of the building blocks for chemical detection.

Challenges and Opportunities in the Miniaturization of the Optical Sensing

Photoplethysmography (PPG) is a non-invasive optical recording method to measure a number of vital signs in a very unobtrusive manner. While PPG has been employed in a clinical setting already for a few decades, it has regained popularity in the last decade specifically for wearable health applications. This talk will discuss the latest-state-of-the-art on ASIC readout architectures for low-power, high performance PPG readout circuits.

Photoplethysmography (PPG) readout interface circuit design techniques

Brain-machine interfaces (BMIS) of the future will be used to treat neurological disorders for which a cure does not exist yet. For this futuristic view to become a reality, we must overcome many technological challenges. A major goal is to increase the number of neurons that we can simultaneously interact with. To do so, future systems will record from more than a thousand channels at the same time. These systems will create a massive amount of raw data that needs to be compressed on the implant to lower the power consumption of the wireless link. As custom signal specifications for BMI applications become clearer and are diverging from those needed for basic neuroscience, there is an opportunity for application-specific lossy compression that improves further the power efficiency of these implants. In this workshop, we will cover the basic aspects of compression for BMIs and describe two different compression schemes for a motor BMI and an artificial retina.

Near-sensor compression in high-bandwidth brain-computer interface

Three key challenges in the design of modern closed-loop neurostimulators for the treatment of neurological disorders, such as intractable epilepsy, are discussed. The first challenge is the need for the best possible efficacy by implementing neuromodulation therapies that are custom-tailored for each patient. Here, the question of where to employ machine learning, whether within the medical device or remotely is addressed, with two energy-efficient implementation examples given: a long-effective-memory SVM and a spatiotemporal CNN. The second challenge is a clear patients’ preference for lower invasiveness – two methods are presented that enable selective recruitment of nerves by decomposing the stimulus signal as it is being delivered to the target. This allows to break the trade-off between invasiveness and selectivity, but requires complex stimulation waveforms applied concurrently with the neural activity recording. As a result, the third challenge is the need for tolerance to stimulation artifacts. Delta-sigma quantization techniques to track fast input transients, by adapting DAC step size, ADC reference voltage and ADC clock frequency, are presented to address this challenge.

Artificially-intelligent Closed-loop Neurostimulators for the Treatment of Neurological Disorders

In this talk, we present emerging technologies for implantable CMOS optoelectronics for interfacing to the brain.

Implantable Optoelectronics for Neural Interfaces

Commercial 5G services have been launched globally. Study and development for technologies toward the evolution of 5G are ongoing, taking into account issues in early 5G services and emerging market needs. In parallel, research focused on technologies and services beyond 5G and 6G is accelerating throughout the world. This presentation will explain NTT DOCOMO's views and our latest activities on 5G evolution and 6G.

5G evolution and 6G: benefits and challenges

In this talk, power amplifier MMICs developed for emerging D-band (110-170 GHz) wireless communication links using InP DHBT technology will be presented. Power amplifiers designed for millimeter-wave frequencies in general suffer from low gain of the transistors and high loss in the interconnect structures. To complicate matters, it is foreseen that higher order modulation formats will be employed to enhance the spectral efficiency in future mm-wave wireless communication links and this dictates strict linearity requirements to the power amplifiers. 
The talk will describe circuit topologies able to exhaust the potential of the InP DHBT technology used and present a low-loss interconnect strategy suitable for the implementation of matching networks and power combining structures. The experimental results of implemented D-band power amplifier MMICs will be presented.

InP DHBT based Power Amplifiers for D-band (110 – 170 GHz) Wireless Communication Links

High data rate communications and high bandwidth communication and sensing systems demand for wideband MMIC operating over a bandwidth with excess of 100 GHz. This talk will introduce such MMICs and their design and characterization challenges. The talk will focus on the widest bandwidth and bandwidth limits as well as the achievable output power, noise figure and gain, as well as constant time delay versus frequency of operation. FBH has demonstrated > 150 GHz bandwidth with output power levels > 12 dBm and concurrent noise-figures of < 9 dB, which allow for robust wideband receive modules and high power transmit modules. Results will also be shown on signal switches and preliminary results on wideband mixers. Routes towards even large bandwidths will be discussed and improvement in output power will be outlined.

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