A typical automotive or industrial end equipment system consists a multitude of analog, power and mixed signal ICs. These ICs are fundamentally driven by similar underlying vectors such as increasing performance and capability while reducing size and cost and maintaining or enhancing reliability.
The talk will focus on key analog and power component careabouts and reliability mechanisms that are critical for scaling these components and also discuss advances in technology and component design that enable scaling while achieving the required technology reliability.

Analog Technology Scaling and Reliability Implications

Quantum Computing has continued to gain traction in having the potential to shape the future of computing. In this talk, I will discuss some of the latest developments in the field - from a technical as well as business viewpoint. This presentation will also share engineering advancements and challenges, not only in the processors powering the quantum computer but the entire system. As we move on the path towards quantum advantage and broader commercialization of this technology, the focus on longer term reliability of the key components will become even more critical and aspects related to superconducting qubit-based quantum computers will be highlighted. Finally, a vision of where we see the inevitable convergence of high performance classical computers (HPC) with quantum computers, in what is termed as quantum-centric supercomputing will be presented.

Utility-scale Quantum Computing - Advances and Future Challenges

In the last decade, we have witnessed an unprecedented revolution of artificial intelligence (AI) as well as various smart devices such as smart phones, AV/VR devices, smart vehicles and robots. Semiconductor is a key player in this revolution as they are at the heart of many inventions related to the computing devices. These transformative trends of AI and smart devices will continue to open up explosive growth opportunities for the semiconductor community. 

Innovative Technologies for Sustainable Future of Semiconductor Industry

Si-friendly HfO2-based ferroelectric devices including FeRAMs and FeFETs are promising for future integrated memory and AI applications with high energy efficiency. On the other hand, a variety of reliability issues can pose serious limitations on the practical applications. This presentation will discuss the promise and reliability of HfO2-based FeRAMs and FeFETs with an emphasis on ferroelectric film thickness scaling, and will also touch on a new AI computation using these devices, reservoir computing.

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Analog Technology Scaling and Reliability Implications

Utility-scale Quantum Computing - Advances and Future Challenges

Innovative Technologies for Sustainable Future of Semiconductor Industry

Hafnium-Oxide-Based Ferroelectric Devices for Low-Power Memory and AI Applications: Promises and Reliability Challenges