United States

Multilevel cell (MLC) Resistive Random Access Memory (RRAM) is an attractive technology option to realize ultra-high density, low-power memory arrays. Traditional 1-transistor 1-resistor (1T1R) bitcell suffers from adjacent state overlap due to the inherent RRAM variations which hinders the realization of MLC capability. In this work, we evaluate an alternate 2-transistor 1-resistor (2T1R) gain-cell RRAM bitcell topology that has higher read-out dynamic range and exhibits higher process variation tolerance compared to the baseline 1T1R bitcell.

DRC 2022

Statistical Analysis of 2T1R Gain-Cell RRAM Bitcell for Area Efficient, High-Performance, and Reliable Multi-level Cell Operation

variation tolerance

multi-level cell

power

rram

density

reliability

#### Welcome to the 60th IEEE International Reliability Physics Symposium (IRPS)!

[![](https://assets.underline.io/uploads/markdown_image/1/image/f6b8cf9ecca2209dd3e0fcebe80a2915.png)](https://underline.io/events/282/reception) [![](https://assets.underline.io/uploads/markdown_image/1/image/e787ff477f8d2b687fb0b54d83d35e11.png)](https://drive.google.com/drive/folders/1GAycr7pPrZG2ZzZP-geUL8vGWswjCB1N?usp=sharing) [![](https://assets.underline.io/uploads/markdown_image/1/image/7492fafcc0c623afe96fe15207855ed9.png)](https://www.irps.org/)
 

**General Chair Welcome Message**

Welcome to IRPS 2022! When the IRPS Management Committee began making plans for Dallas, we recognized the strong desire by the reliability physics community to return to a face-to-face symposium that we last had in Monterey in 2019. But as time progressed, we recognized that travel restrictions were not being lifted as rapidly as we anticipated. Rather than leave out those of you who could not attend in person, we adopted a hybrid format allowing for both remote attendance and remote presentations. This is a first for IRPS and I am confident it will be a success for all.

With this new hybrid format, the symposium will return to the original five-day format with Tutorials and Year in Review on the first two days. The Technical Program, Keynote Talks, Workshops and Poster session will be held on the following three days. All of these (except Workshops and Posters) will be available via real-time streaming in the US Central Time zone with virtual attendees having Q&A access to the presenters. For those virtual attendees who cannot watch the live presentations, the material will be available on demand to all attendees for a month after the symposium with the ability to communicate with the authors.

In 2020, we were planning on co-hosting the International ESD Workshop (IEW) ESD workshop when the COVID-19 pandemic hit. For 2022, IEW will be seamlessly embedded into the IRPS Program and will sponsor three tutorials, an invited talk, two technical sessions and two evening workshops focused on ESD and latch-up. And we continue our
collaboration with our sister conference, European Symposium on Reliability of Electron Devices Failure Physics and Analysis (ESREF) by hosting their Best Paper and the International Integrated Reliability Workshop (IIRW) by hosting their Best Student Paper.

Our primary objective is to maintain the symposium’s leadership role in the reliability physics of microelectronic devices by attracting leading researchers to present their work and providing attendees the best place to access this information. With all the buzz in the media about whether Moore’s Law has hit its limit, IRPS has been promoting expertise developed in silicon-based reliability over the past sixty years and expanding into new material areas. This year, eight of the technical sessions are devoted to reliability in topics outside of traditional silicon, including wide bandgap GaN/SiC, emerging memory and neuromorphic computing. I hope our ability to draw these communities together will accelerate the cross-fertilization of ideas. 

The Technical Program consists of four keynote speakers, twenty-three invited speakers and eighty-seven oral presentations organized in thirty technical sessions on eighteen reliability topics. Over two evenings, there will be ten Workshops and sixty-six Poster presentations that are designed to allow in person attendees and experts to interact
with one another. With eighteen tutorials covering topics ranging from fundamental transistor and memory reliability all the way up to automotive and complex system-level reliability, this year’s symposium provides an excellent learning opportunity for engineers and scientists new to reliability as well as experienced individuals wanting to explore new
areas. The Year in Review, which serves as a summary of research in the past year, will cover 3D packaging, emerging memory and aging aware circuit designs.

Finally, I would like to express my extreme gratitude to our patrons and exhibitors, whose support makes IRPS possible.
And to all of you, our in person and virtual attendees, for supporting this symposium for sixty years!

**Charles W. Slayman, General Chair** 
**of 2022 IRPS Management Committee**
 
**About IRPS**

The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.

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IRPS 2022 Main Conference 

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

technical paper

[![](https://assets.underline.io/uploads/markdown_image/1/image/985c8a40b04e56675221c8549975de3c.png)](https://drive.google.com/file/d/1B70nPIeeeqdG4UU70NlYXuKVOHLRuJEo/view?usp=sharing)

### ** History of DRC**
The Device Research Conference (DRC) began in the pre-transistor era with the 1942 establishment of the Conference on Electron Device Research (CEDR). Following William Shockley’s 1948 CEDR presentation of the transistor device, the Solid-State Device Research Conference (SSDRC) was established, with invitation-only attendance.

In the ensuing decades, many exciting firsts were presented at SSDRC, including the use of impurity diffusion in silicon and germanium, the first practical MOSFET, and the first lattice-matched heterojunction.

In 1969, under the leadership or Herbert Kroemer and Cal Quate, the CEDR and SSDRC merged into DRC. In 1970, attendance was opened to all, and the first DRAM (dynamic random-access memory), room temperature lasers, and first CCD (charge-coupled device) were reported—all in the same 1970 DRC meeting!

1976 saw the first official coordination of tandem meetings between DRC and the Electronic Materials Conference (EMC) to bring together the electronic materials and device communities—a custom which persists to this day. In 1991, DRC began publishing its digest with IEEE; they can all be found [here on IEEE Xplore](https://ieeexplore.ieee.org/xpl/conhome/1000199/all-proceedings). Throughout this period, DRC featured reports of many novel and record-setting devices, including the HEMT (High Electron Mobility Transistor), VCSEL (Vertical Cavity Surface Emitting Laser), HBT (Heterojunction Bipolar Transistor), and nanoscale MOSFETs.

In recent years, DRC has continued to be the world’s premier forum to present innovative semiconductor device research with work on organic thin film transistors, graphene and carbon nanotube transistors, and 2D materials all featuring prominently in the 1990s through to the present day. In 2017, we celebrated DRC’s 75th anniversary with special sessions and an [article in the Journal of the Electron Device Society](https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8168249&isnumber=8232486). DRC technical topics continue to evolve with emerging device trends such as memory devices, quantum devices, optoelectronics/photonics, and wide bandgap power devices to reflect the exciting work being done by a diverse community of device engineers around the globe.

Today, as we look forward to the next 75+ years of device innovation, DRC continues to lead the way in showcasing top-caliber research, facilitating vibrant discussion and debate and acting as a platform to nurture the next generation of device engineers. We welcome you to join us at the next DRC!

To learn more about DRC's history, please see [Aaron Franklin, Debdeep Jena and Deji Akinwande, "75 Years of the Device Research Conference—A History Worth Repeating," in IEEE Journal of the Electron Devices Society, vol. 6, pp. 116-120, 2018. doi: 10.1109/JEDS.2017.2780778](https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8168249&isnumber=8232486).

### **Topics**
* Biological Devices
* Devices for Extreme Conditions
* Heterogeneously Integrated Devices
* Memory Devices
* Modeling and Simulation of Devices
* Nanoscale and Vacuum Devices
* Optoelectronic and Optical Devices
* Other Emerging Devices
* Power Devices
* Quantum Devices
* RF and Terahertz Devices
* Spintronic and Magnetic Devices
* Thin-film Devices
* Wide-bandgap Devices
 
### **Invited Speakers**
* Patrick Fay, University of Notre Dame
* Susanne Hoffmann-Eifert, Peter Grünberg Institute
* Sanghyeon Kim, Korea Advanced Institute of Science and Technology
* Sriram Krishnamoorthy, University of California, Santa Barbara
* Mario Lanza, King Abdullah University of Science and Technology
* Xiuling Li, The University of Texas at Austin
* Marko Radosavljevic, Intel Corporation
* Siddharth Rajan, The Ohio State University
* Giordano Scappucci, Delft University of Technology
* Fisher Yu, University of Arkansas
* Wenjuan Zhu, University of Illinois at Urbana-Champaign




Registration is required to attend this event. If you have not already done so, please use the link below to register for a ticket to the conference:

https://www.mrs.org/drc-2022/registration

Registration Is Required

DRC continues to be the world’s premier forum to present innovative semiconductor device research with work on organic thin film transistors, graphene and carbon nanotube transistors, and 2D materials all featuring prominently in the 1990s through to the present day. In 2017, we celebrated DRC’s 75th anniversary with special sessions and an article in the Journal of the Electron Device Society. 
DRC technical topics continue to evolve with emerging device trends such as memory devices, quantum devices, optoelectronics/photonics, and wide bandgap power devices to reflect the exciting work being done by a diverse community of device engineers around the globe.

Movement of Current Filaments and its Impact on Avalanche Robustness in Vertical GaN P-N diode Under UIS stress

We present a simple composite analytical model that covers the entire electric-field range with excellent accuracy, with the use of an empirically-derived extrapolation function in the TFE-to-FE transition region. The composite TE-TFE-FE model successfully bridges the gap between TFE and FE regimes, allowing for accurate modeling of the Schottky barrier reverse current across the entire electric-field range. The closed-form and local nature of the composite model allows for easy implementation in TCAD tools for device design and analysis.

A Composite TE-TFE-FE Model for Schottky Barrier Reverse Current over the Entire Electric-Field Range

A versatile but extremely compact memristor model is introduced that is capable of emulating various memristive technologies while featuring fully analog, flux-linkage controlled operation as well as temporal tunability. Computation with time is a layer of complexity that could help break through barriers in the field of non-traditional compute and is extremely bio-mimetic, as the brain is exceptionally adept at temporal processing. This talk will explore some examples of temporal computation using simulated memristive hardware.

An Experimentally Validated, Universal Memristor Model Enabling Temporal Neuromorphic Computation

In this work, we demonstrate vertically stacked multilayer atomic-layer-deposited sub-1nm In2O3 field-effect transistors (FETs) with surrounding gate in a back-end-of-line (BEOL) compatible low-temperature fabrication process. Multilayer FETs with number of In2O3 layers up to 4 and 1.2 nm-thick HfO2 between each individual layer are fabricated. An enhancement of on-state current (ION) from 183 μA in single layer In2O3 FET to 339 μA in 4 layer device with on/off ratio of 3.4×10^4 is achieved.

Vertically Stacked Multilayer Atomic-Layer-Deposited Sub-1-Nanometer In2O3 Field-Effect Transistors with BEOL Compatibility

For p-type Cu2O thin film transistors (TFTs), high contact resistance is one of the critical issues that limit field effect mobility. Thus, to alleviate the contact resistance issue, in this work, we for the first time demonstrated Cu2O TFTs with nitrogen-doped Cu2O S/D interlayer. We observe a reduced contact resistance and improved field effect mobility when the N:Cu2O S/D interlayer is used.

N:Cu2O S/D for low contact resistance p-type Cu2O thin film transistor

Metal oxides (e.g., In2O3, InZnO) have been demonstrated to be excellent materials for flexible electronics. Solution-processed methods offer a cost-effective and high uniformity route to deposit the metal oxides on a variety of substrates. However, post-processing is often necessary and it becomes a challenge on plastic substrates. Here, we explore photonic curing to process the semiconductor material without substantially heating the plastic substrate.

Photonic Curing: Rapid Thermal Processing of Oxide Thin-film Transistors on Plastic

In this work, atomically thin ALD Zn-doped or InZnO are investigated for the first time as a BEOL channel. Outstanding device performance on InZnO transistors is achieved including on-off current ratio of 1e7 and 1e9, on-current density of 1.6 A/mm and 1.2 A/mm with In:Zn ALD cycle ratio of 10:1 and 5:1, respectively, without optimization annealing. This work provides a new route to explore new BEOL oxide semiconductor channels beyond In2O3 achieving better current saturation at higher drain voltage and higher power amplification

Atomically-thin atomic-layer-deposited InZnO transistors with BEOL compatibility

Monolayer 2D material WSe2 provides an unique platform for exploring the generation and control of spin and valley polarization. In this work we conduct Kerr rotation measurements on monolayer WSe2 transisors to show the electrical control and temperature dependence of the spin and valley polarization generated by the spin and valley Hall effect (SVHE). A drift-diffusion theory along with the reflection spectra and electrcal IV curves are used to interpret the data and extract meaningful parameters.

Controlling the Spin and Valley Hall Effect in Monolayer WSe2 at Elevated Temperatures

Late News: High Voltage β-Ga2O3 Lateral Schottky barrier diode with High Permittivity Dielectric RESURF demonstrating > 1 GW/cm2 Power Figure of Merit

Here, we demonstrate improvement in the mobility and on-state current of monolayer MoS2 transistors using a high-tensile-stress SiNx capping layer. We demonstrate its applicability to achieve high currents in both back- and top-gated device configurations. We achieve up to 47% improvement in back-gated FET mobility and on-state current, then extend the technique to achieve 33% improved current drive in top-gated FETs, with record saturation current up to 488 μA/μm in a 200 nm long channel.

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Movement of Current Filaments and its Impact on Avalanche Robustness in Vertical GaN P-N diode Under UIS stress

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Movement of Current Filaments and its Impact on Avalanche Robustness in Vertical GaN P-N diode Under UIS stress

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Experimental demonstration of Single-Level and Multi-Level-Cell RRAM-based In-Memory-Computing with up to 16 parallel operations

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