France

There is a rapidly increasing interest in beyond-5G and 6G wireless networks for the next-generation communication and sensing platform. It is envisioned that the upper mm-Wave and sub-THz frequencies (e.g. 100GHz to 240GHz) spectrum will be the major spectrum of interest due their abundant available bandwidth (BW) to achieve the “holy grail” of 1Tb/s wireless network throughput. It is also expected that large-scale arrays with massive elements will be a necessity and ubiquitously to provide huge array gains and compensate for the high-frequency path loss.
However, a major challenge at the physical layer for these beyond-5G and 6G networks is the lack of energy-efficient, wideband, and ultra-compact frontend electronics, in particular power amplifiers, at high mm-Wave/sub-THz. This is even more problematic for large-scale densely-packed arrays, where thermal management becomes a severe issue. Further, next-generation wireless links demand ultra-wideband modulations and high efficiency, while radar/imaging/sensing systems require large instantaneous BW. Despite of decades of research on integrated power amplifiers, most of these efforts have focused on RF and mm-Wave PAs, while high mm-Wave/sub-THz PAs entail distinct challenges at both device and circuit levels. In this talk, we will review the current state of the art of the high mm-Wave and sub-THz frequencies PAs, including PAs in both silicon and III-V technologies. A variety of challenges and performance limitations will be outlined. Then, we will present several recently published mm-Wave/sub-THz PA designs as examples to showcase the present capabilities. Future technology trends and potential devices/circuits solutions will be discussed as well.


ESSCIRC ESSDERC Educational Events

Millimeter Wave and Sub-THz Power Amplifiers ― Enabling Technologies for Beyond-5G and 6G Wireless Networks

wireless communication and sensing

power amplifer

nextg

#### Welcome to the 60th IEEE International Reliability Physics Symposium (IRPS)!

[![](https://assets.underline.io/uploads/markdown_image/1/image/f6b8cf9ecca2209dd3e0fcebe80a2915.png)](https://underline.io/events/282/reception) [![](https://assets.underline.io/uploads/markdown_image/1/image/e787ff477f8d2b687fb0b54d83d35e11.png)](https://drive.google.com/drive/folders/1GAycr7pPrZG2ZzZP-geUL8vGWswjCB1N?usp=sharing) [![](https://assets.underline.io/uploads/markdown_image/1/image/7492fafcc0c623afe96fe15207855ed9.png)](https://www.irps.org/)
 

**General Chair Welcome Message**

Welcome to IRPS 2022! When the IRPS Management Committee began making plans for Dallas, we recognized the strong desire by the reliability physics community to return to a face-to-face symposium that we last had in Monterey in 2019. But as time progressed, we recognized that travel restrictions were not being lifted as rapidly as we anticipated. Rather than leave out those of you who could not attend in person, we adopted a hybrid format allowing for both remote attendance and remote presentations. This is a first for IRPS and I am confident it will be a success for all.

With this new hybrid format, the symposium will return to the original five-day format with Tutorials and Year in Review on the first two days. The Technical Program, Keynote Talks, Workshops and Poster session will be held on the following three days. All of these (except Workshops and Posters) will be available via real-time streaming in the US Central Time zone with virtual attendees having Q&A access to the presenters. For those virtual attendees who cannot watch the live presentations, the material will be available on demand to all attendees for a month after the symposium with the ability to communicate with the authors.

In 2020, we were planning on co-hosting the International ESD Workshop (IEW) ESD workshop when the COVID-19 pandemic hit. For 2022, IEW will be seamlessly embedded into the IRPS Program and will sponsor three tutorials, an invited talk, two technical sessions and two evening workshops focused on ESD and latch-up. And we continue our
collaboration with our sister conference, European Symposium on Reliability of Electron Devices Failure Physics and Analysis (ESREF) by hosting their Best Paper and the International Integrated Reliability Workshop (IIRW) by hosting their Best Student Paper.

Our primary objective is to maintain the symposium’s leadership role in the reliability physics of microelectronic devices by attracting leading researchers to present their work and providing attendees the best place to access this information. With all the buzz in the media about whether Moore’s Law has hit its limit, IRPS has been promoting expertise developed in silicon-based reliability over the past sixty years and expanding into new material areas. This year, eight of the technical sessions are devoted to reliability in topics outside of traditional silicon, including wide bandgap GaN/SiC, emerging memory and neuromorphic computing. I hope our ability to draw these communities together will accelerate the cross-fertilization of ideas. 

The Technical Program consists of four keynote speakers, twenty-three invited speakers and eighty-seven oral presentations organized in thirty technical sessions on eighteen reliability topics. Over two evenings, there will be ten Workshops and sixty-six Poster presentations that are designed to allow in person attendees and experts to interact
with one another. With eighteen tutorials covering topics ranging from fundamental transistor and memory reliability all the way up to automotive and complex system-level reliability, this year’s symposium provides an excellent learning opportunity for engineers and scientists new to reliability as well as experienced individuals wanting to explore new
areas. The Year in Review, which serves as a summary of research in the past year, will cover 3D packaging, emerging memory and aging aware circuit designs.

Finally, I would like to express my extreme gratitude to our patrons and exhibitors, whose support makes IRPS possible.
And to all of you, our in person and virtual attendees, for supporting this symposium for sixty years!

**Charles W. Slayman, General Chair** 
**of 2022 IRPS Management Committee**
 
**About IRPS**

The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.

Please log in to explore this event. You need to log in with the email address you registered with. Access credentials have been sent to your email. 

Please log in to explore this event.

Registration for this conference has now closed. We appreciate your interest and hope to welcome you at a future event. If you’d like to hear about similar upcoming events, please check our website or join our mailing list.

Registration for this conference has now closed.

IRPS 2022 Main Conference 

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

Please register for educational events at the following link: https://www.registerme.eu/event/esscirc-essderc-2021/

Please register for the ESSCIRC/ESSDERC Educational Events to join the event.

The Educational Events of ESSCIRC ESSDERC 2021. 

The novel photo-acoustic CO2 sensor SCD4x launched by Sensirion in early 2021 represents a major innovation step in the miniaturization and cost-reduction of selective and long-term stable CO2 sensor technology. Being the first optical CO2 sensor compatible with surface-mounting technology and made for reflow soldering, the sensor allows for a broader adoption of indoor air quality monitoring both in residential air conditioning as well as internet of things devices. In my talk I will address how MEMS and CMOS technology combined with tailored assembly and packaging designs has enabled shrinking a measurement system previously reserved for scientific laboratories to an SMD component of the size smaller than a sugar cube.

Breaking the size barrier in CO2 sensing: the photo-acoustic CO2 sensor “SCD4x”

In recent years, an enormous surge of works is being carried out on developing new methods for magnetic devices for various kinds of healthcare applications. Miniaturising magnetic sensors offer the prospect to replace the bulky laboratory instruments with easy-to-use clinical platforms ranging from portable lab-on-a-chip diagnostics to wearable and implantable devices. It would bring down the cost, size and out-of-hospital use by several orders of magnitude. Implementation of such magnetic sensing microsystems using traditional CMOS technology is inefficient in terms of area, sensitivity and signal to noise ratio. Such inefficiencies have driven a significant effort to investigate the development of beyond-CMOS devices. Integration of magnetoresistive devices, e.g. Tunnelling Magnetoresistive (TMR), with CMOS technology provides an opportunity to produce and optimise powerful and low-power devices for low biomagnetic field applications. Such heterogeneously structure combining the CMOS circuitry interface and non-CMOS sensors higher performance electronics for detecting pico-Tesla magnetic field. 
The talk will introduce our research at the Microelectronics Lab (www.melabresearch.com) at the University of Glasgow on integrated electronic circuits and sensors with several different works addressing the development of architectures for the implementation of efficient biomedical wearable and implantable technologies. It presents findings and trends in magnetic sensing devices, including:
(i) Tunnelling magnetoresistive (TMR) sensors and circuit Interfaces for malaria parasite detection
(ii) Integrated micro–Nuclear Magnetic Resonance (micro-NMR) for point of care diagnostics
(iii) Implantable Magnetomyography (MMG) with magnetoelectric (ME) and TMR sensors 
(iv) Spintronic sensors based on Magnetic Tunnel Junction for wearable eye movements monitoring


Principles of Magnetic Sensing in Medical Microsystems

In less than a decade, optical sensing has become a key topic because of the growing potential in spectroscopy, chemical and biomolecular sensing, security and industry applications. This talk presents recent results on the chip level integration of the building blocks for chemical detection.

Challenges and Opportunities in the Miniaturization of the Optical Sensing

Photoplethysmography (PPG) is a non-invasive optical recording method to measure a number of vital signs in a very unobtrusive manner. While PPG has been employed in a clinical setting already for a few decades, it has regained popularity in the last decade specifically for wearable health applications. This talk will discuss the latest-state-of-the-art on ASIC readout architectures for low-power, high performance PPG readout circuits.

Photoplethysmography (PPG) readout interface circuit design techniques

Brain-machine interfaces (BMIS) of the future will be used to treat neurological disorders for which a cure does not exist yet. For this futuristic view to become a reality, we must overcome many technological challenges. A major goal is to increase the number of neurons that we can simultaneously interact with. To do so, future systems will record from more than a thousand channels at the same time. These systems will create a massive amount of raw data that needs to be compressed on the implant to lower the power consumption of the wireless link. As custom signal specifications for BMI applications become clearer and are diverging from those needed for basic neuroscience, there is an opportunity for application-specific lossy compression that improves further the power efficiency of these implants. In this workshop, we will cover the basic aspects of compression for BMIs and describe two different compression schemes for a motor BMI and an artificial retina.

Near-sensor compression in high-bandwidth brain-computer interface

Three key challenges in the design of modern closed-loop neurostimulators for the treatment of neurological disorders, such as intractable epilepsy, are discussed. The first challenge is the need for the best possible efficacy by implementing neuromodulation therapies that are custom-tailored for each patient. Here, the question of where to employ machine learning, whether within the medical device or remotely is addressed, with two energy-efficient implementation examples given: a long-effective-memory SVM and a spatiotemporal CNN. The second challenge is a clear patients’ preference for lower invasiveness – two methods are presented that enable selective recruitment of nerves by decomposing the stimulus signal as it is being delivered to the target. This allows to break the trade-off between invasiveness and selectivity, but requires complex stimulation waveforms applied concurrently with the neural activity recording. As a result, the third challenge is the need for tolerance to stimulation artifacts. Delta-sigma quantization techniques to track fast input transients, by adapting DAC step size, ADC reference voltage and ADC clock frequency, are presented to address this challenge.

Artificially-intelligent Closed-loop Neurostimulators for the Treatment of Neurological Disorders

In this talk, we present emerging technologies for implantable CMOS optoelectronics for interfacing to the brain.

Implantable Optoelectronics for Neural Interfaces

Commercial 5G services have been launched globally. Study and development for technologies toward the evolution of 5G are ongoing, taking into account issues in early 5G services and emerging market needs. In parallel, research focused on technologies and services beyond 5G and 6G is accelerating throughout the world. This presentation will explain NTT DOCOMO's views and our latest activities on 5G evolution and 6G.

5G evolution and 6G: benefits and challenges

In this presentation, background and motivation will be explained for mmW/THz wireless communication as well as basics of phased-array theory. The theoretical limitation and possible direction of mmW/THz wireless communication is discussed with a THz phased-array transceiver implemented by 65nm CMOS.


Millimeter-wave/THz Phased-Array Transceiver for Beyond 5G

High data rate communications and high bandwidth communication and sensing systems demand for wideband MMIC operating over a bandwidth with excess of 100 GHz. This talk will introduce such MMICs and their design and characterization challenges. The talk will focus on the widest bandwidth and bandwidth limits as well as the achievable output power, noise figure and gain, as well as constant time delay versus frequency of operation. FBH has demonstrated > 150 GHz bandwidth with output power levels > 12 dBm and concurrent noise-figures of < 9 dB, which allow for robust wideband receive modules and high power transmit modules. Results will also be shown on signal switches and preliminary results on wideband mixers. Routes towards even large bandwidths will be discussed and improvement in output power will be outlined.

Downloads

Next from ESSCIRC ESSDERC Educational Events

Breaking the size barrier in CO2 sensing: the photo-acoustic CO2 sensor “SCD4x”

Similar lecture

6G Roadmap for Semiconductor Technologies: Challenges and Advances

.css-70qvj9{display:-webkit-box;display:-webkit-flex;display:-ms-flexbox;display:flex;-webkit-align-items:center;-webkit-box-align:center;-ms-flex-align:center;align-items:center;}Downloads

Next from ESSCIRC ESSDERC Educational Events

Breaking the size barrier in CO2 sensing: the photo-acoustic CO2 sensor “SCD4x”

Similar lecture

6G Roadmap for Semiconductor Technologies: Challenges and Advances

Downloads